TRIton®
Our reflectometer for obtaining fully automated end point detection (EPD) during plasma etching processes.
LayTec’s TRIton® is a reflectometer especially designed to obtain fully automated in-situ end point detection (EPD), during dry etch processes of various material systems. It may be used with different layer stacks, material/alloy compositions, initial layer thicknesses and wafer diameters.
EPD during ICP etching for nitrides, arsenides and phosphides
EPD during atomic layer etching processes
Further processes may be addressed upon request
Within layer EPD for various materials and process classes
Automatic and reproducible endpoint detection for plasma etching
Camera-based point and click measurement spot positioning
Sub-nm resolution down to 0.5 nm can realized
Required test pad area of 0.5 x 0.5 mm
Features
EtchNet®
EtchNet® is LayTec’s standard metrology software for etch monitoring using metrology tool of the TRIton® family. It is shipped with every metrology system.
SimulyzR
SimulyzR is LayTec new software for pre- and post-run modelling and analysis of optical reflectance data.
Connected metrology® approach “from epi to etch”
Combine TRIton® with LayTec’s EpiCurve® TT and/or EpiX® metrology systems to get full control of your frontend processes.
Contact
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