Methods

The smart combination of well selected measurement techniques is the key to cost- and performance-optimized process monitoring. Thanks to our modular metrology concept, we can combine multiple methods in one system to offer you the perfect combination of control parameters for your particular process, deposition system or application.

3 WL reflectance

Growth rate, thickness and morphology by in-situ monitoring of multiple wavelength reflectance

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Spectroscopic R&T

Growth rate, thickness and morphology by in-situ monitoring of spectral reflectance

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Infrared pyrometry

Yield improvement through temperature uniformity

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Ultraviolet pyrometry

Wafer surface temperature for IR-transparent substrates

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Deflectometry/​curvature measurements

Deflectometry for wafer curvature measurements

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Photoluminescence

Characterizing the electronic quality of a semiconductor.

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Thermomechanical indentation

Thermomechanical indentation

Nondestructive testing of polymer properties.

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Eddy-Current-Sensing

Eddy-Current-Sensing

Fast in-line conductivity process control.

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Reflectance Anisotropy Spectroscopy (RAS)

Reflectance Anisotropy Spectroscopy (RAS)

Monitors the properties of surfaces, interfaces and doping-induced surface electric fields.

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Contact

We look forward to hearing from you and will try to answer your questions or respond to your message as best we can. Please use one of the following contact options.

infolaytec.de +49 30 8900550

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