LayTec at SPIE Photonics West 2025

Shaping the future of optical metrology

At this year’s SPIE Photonics West in San Francisco, LayTec presented its latest advancements in in-situ and ex-situ optical metrology for semiconductor device manufacturing. Our talk highlighted how integrated metrology enhances process control and device performance in the production of edge-emitting lasers and VCSELs (vertical-cavity surface-emitting lasers).

Key innovations featured in our presentation included:

• Real-time, in-situ monitoring during MOCVD and dry etching, enabling precise control of growth rate, temperature, and composition.

• Wafer mapping solutions for evaluating uniformity and layer quality through photoluminescence and reflectance analysis.

• A comprehensive “connected metrology” ecosystem, combining data from multiple stages of the process chain to optimize yield and reduce cost.

• A robust calibration scheme for VCSEL production, improving layer accuracy to within ±0.5 nm using in-situ assisted feed-forward techniques.

LayTec’s metrology solutions empower manufacturers to better understand and control their production processes – paving the way for higher yields, reduced costs, and superior device performance.